Ball Grid Array Assembly

Column grid assembly for blast furnace

As electronic devices become more and more complex, smarter technologies evolve to counter the forces of market change. One such technology that was developed as a packaging alternative for high I/O devices was the ball grid array. Sienna Corporation makes this high-end technology available to all its partner OEMs. Ball grid arrays, which fall under the category of Surface Mount Technology, have reduced the co-planarity and placement problems. It has better performance characteristics with regard to thermal and electrical characteristics. Though BGA is considered as a low cost alternative to fine pitch leaded surface mount, it offers specific advantages. Reduced handling problems Higher board assembly yields Quick design to product cycle time

We have established ourselves as a prominent manufacturer and supplier of a comprehensive collection of Micro circuit PCB Modules / Ball Grid Array.These are designed and developed in compliance with international standards. We can also design and develop these as per the specific demands of clients. We stringently check these PCB modules on well defined parameters before offering these to clients. Our range of micro circuit PCB modules is available at cost effective prices and within the stipulated time period.

BALL GRID ARRAY ASSEMBLY Service

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Ball Grid Array (BGA) is a one face, or partially covered package with a grid pattern of balls. BGA's are used to create signals of electricity to printed circuit boards. We have solutions for all your BGA rework and repair needs. We're equipped with top-of-the line BGA rework systems and a staff of engineers and operators with in-depth knowledge and experience at the intricate process of BGA rework. We offer a wide variety of services including BGA component removal, replacement and salvage; x-ray inspection; circuit pattern design changes at BGA sites; repair of lifted or missing BGA balls; and repair of solder mask at the BGA sites. We also offer training and technical support to provide you with one stop shopping for BGA repair and rework.

As electronic devices become more and more complex, smarter technologies evolve to counter the forces of market change. One such technology that was developed as a packaging alternative for high I/O devices was the ball grid array. Sienna Corporation makes this high-end technology available to all its partner OEMs. Ball grid arrays, which fall under the category of Surface Mount Technology, have reduced the co-planarity and placement problems. It has better performance characteristics with regard to thermal and electrical characteristics. Though BGA is considered as a low cost alternative to fine pitch leaded surface mount, it offers specific advantages. Reduced handling problems Higher board assembly yields Quick design to product cycle time

Ball Grid Array (BGA) is a one face, or partially covered package with a grid pattern of balls. BGA's are used to create signals of electricity to printed circuit boards. We have solutions for all your BGA rework and repair needs. We're equipped with top-of-the line BGA rework systems and a staff of engineers and operators with in-depth knowledge and experience at the intricate process of BGA rework. We offer a wide variety of services including BGA component removal, replacement and salvage; x-ray inspection; circuit pattern design changes at BGA sites; repair of lifted or missing BGA balls; and repair of solder mask at the BGA sites. We also offer training and technical support to provide you with one stop shopping for BGA repair and rework.

Provides you with a repeatable process with every project meeting the highest quality standards. We're recognized as an industry We have 5 top-line Air-Vac BGA rework systems and a fully trained staff of engineers and operators to support you. This combination leader in BGA services and have been qualified by companies around the world. Whether you have one board or one thousand boards for rework, we're the company to turn to for BGA rework services. BGA rework is a challenge, but not for the experts at Circuit Technology Center.

We are leading provider of complete PCB assembly and manufacturing services ranging from Printed Circuit Assembly to Complete System Integration and Box Build. Our customers are satisfied with our high-standards of electronic manufacturing services. We specialize in quick-turn services for highly complex and advanced PCB assembly and systems manufacturing in meeting dynamic business needs. We have a competent engineering and manufacturing team to help many customers to give complete solutions to all kinds of PCB manufacturing requirements. East India Technologies is providing best services in PCB prototyping. After many tests, validation and with the help of our top quality assurance model, we provide the best version of the product and serves the client to analyze the functional design of their desired product.

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