Die Bonder

Our reputed entity is engaged in supplying Die Bonder.

We are amongst the most reputed names in the industry, offering Die Bonder.

High speed and High accuracy flexible Die Bonder for SiP (System in Package) with 300mm wafer handling capability. World's smallest class of die bonder for 300mm wafer (Reducing size, light weight and low vibration design) High UPH is realized by new bonding head mechanism Response to stacked package production with multiple connection

Bonder

MD-P200 Die Bonder

FINEPLACER matrix ma Semi-automatic Die Bonder

MAT DIE BONDERS

Our reputed entity is engaged in supplying Die Bonder.

Banking on our enriched industry experience, we are able to supply Die Bonder.

The Die Bonder DB 2008 can handle different types of endless Smart Card tapes. It handles 6" to 12" (300 mm) wafers and guarantees repeatable constant die bonding quality, independent of the user. A compact in-line curing oven guarantee best performance due to individual heating zones.

We are a top-notch organization, engaged in providing Die Bonder.

Wire Bonding & Die Attachment

AUTOMATIC BATTERY BONDER

Pick & Place System with Rotary Pick-up ToolCapable to pick from Wafer or TrayPowerful Wafer Map processing softwareFlexible Epoxy Dispensing ConfigurationFlexible Output ConfigurationHigh performance Vision & Pattern Recognition SystemsOptional bottom view CCTV for post pick inspectionProgrammable parameters for process and motion controlsWindows based GUI user interfaceStand-alone or in-line configuration.

We are engaged in offering Die Bonder.

Perma Bonder

Die Bonder

SUB-MICRON TABLE TOP DIE BONDER

FINEPLACER Femto 2

MRSI Die Bonders

Bonder

Die Bonder Machine

die bonder machine