Laser Drilling Machine

Developed for high-speed, high-precision drilling applications for soft and rigid combination boards and other materials, with high precision, high efficiency, micro-hole processing, and convenient shape change, as well as processing for shape and cover film cutting. Original patented technology - FPC Laser Shield Laser drilling Technology, developed ultraviolet high-speed drilling equipment to achieve blind holes in one hit. Product advantages: With the development of printed circuit boards towards refinement, high density and high performance, precision lasers are more and more widely used in the downstream industry of circuit boards because of their non-contact, stressless, and flexible processing characteristics. HGLASER PCB Microelectronics Division provides integrated solutions for the upstream and downstream industries of PCB such as laser cutting, marking, automation, and full-process traceability management. Focus on laser applications in SMT factories, providing customers with automated production line solutions for laser coding, laser cutting and splitting + testing + automatic sorting + automatic packaging. Focus on the application of FPC industry, providing customers with professional solutions for the core process of FPC cover film roll-to-roll cutting, FPC shape cutting, FPC high-speed drilling and other industries. Focus on the application of IC substrate industry in PCB, providing customers with laser marking equipment for large IC substrates, Xout marking equipment for finished boards, visual inspection machines for finished boards, AOI inspection machines, automatic sorting machines, automatic packaging machines and other full-process laser+ automated solutions. Focus on the advanced packaging industry, providing customers with fully automatic laser marking equipment after IC packaging. Focus on the ceramic substrate industry, providing customers with fully automatic ceramic substrate drilling, scribing, cutting and marking equipment.

Matching up with the ever increasing requirements of the customers, our company is engaged in providing CO2 Laser Drilling Machine. Features: Rust proofLow maintenancePrecisely engineered

Salient Features : A counter is provided for counting actual production in no. Of tablets with memory Disk speed is adjustable from almost 100 tablet per in flute to 400 tablet per minute All pads which may come in to contact with the tablet are either ss3 16 or food grade plastic All other parts are mostly ss 316 or aluminium (like the laser head body) The beam lense is protected by a small purging air Smoke from the tablet is removed while drilling by negative pressure (suction) which is in close vicinity of the tablet drilling location (75% fumes are effectively removed) The whole system can be operated in manual or automatic mode The system can be used for single colour tab et by switching off one laser. The whole process is guaranteed for production of drilled tab ets with reliability of 10000:1 To reduce rejection of good tablets second stage inspection by camera can be provided

Specifications: Laser Drilling is now more effective and easier than ever before. Due to their compact design and high degree of flexibility, the ACSYS laser drilling centers are in a class of their own and are setting new benchmarks. Automatic distance control and highly dynamic linear motors guarantee extremely precise machining results in minimum time for sheet metal sizes up to 700 x 1000 m . Additionally, a software-controlled dividing head as a fourth rotary axis and a manually adjustable fifth axis can be used for interpolated laser cutting. This allows round parts to be machined Whether the task is to machine inlays, templates or high-precision cut parts in a wide range of different industries - with our laser cutting systems and the AC-LASER Software Suite, our customers will always be a step ahead of the competition

Features:DurableCompact designRugged construction

SPD-2000U, the hybrid type of single beam/single panel UV laser drilling system, is designed to make blind via holes and through holes on the PCB substrate. ModelSPD2000ULaserWavelength()10.6Average power(W)10ScannerScan field(mm x mm)500UtilitiesElectricity3-phase, 220V, 50/60Hz, 250APressure air>5 kgf/, 400/minExhaust300mmAq, 250/min

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Place resin or plaster model on the middle of the platform. Drill's position its indicated by means of LASER point; this is the pointer of the drill s vertical. By pushing the switch-plate the drill will carry out automatically the operation by the up-down and turnning movement

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