Alloy Composition: Sn63 Pb37
Preform Shape: Ribbon
Flux Type: No Clean
Packaging Type: Tape & Reel
Material Type: ROHS/Non ROHS
Material Composition: leaded /leadfree
Material Melting Temperature: As per alloy
Material: leaded/leadfree
Application: widely used in Semiconductor Connecting, aerospace, optical communications, power electronics
Material Type: preform
Material: Gold Tin Alloy
Material Composition: Au80Sn20,Au88Ge12, Au96.85Si3.15, Sn63Pb37, In97Ag3, Bi58Sn42, Ag72Cu28, AlSi27, AlSi50, AlSi70, Al4
Usage/Application: For Soldering
Physical State: Solid
Material Type: Tape and Reel Packaging
Material Composition: SAC-305 (Size 1.6x0.8x0.8mm)
Physical State: Solid
Alloy: Sn/Zn, Sn/Ag/Sb and Sn/Bi
Material Type: Preform
Size: Customizable
Material Type: preforms
Material Composition: Sn42Bi58 solder preform Au80Sn20 solder preform Low temperature solder preform High temperature sold
Material Melting Temperature: HIGH
Country of Origin: Made in India
Material: Tin, silver, copper
Material Composition: Sn96.5Ag3.0Cu0.5
Color: Silver
Size: Customization

